Advances in Semiconductor Materials 2025–2026
What Is Technically Real—and What Matters for Implementation
Five material and integration developments are assessed against their demonstrated maturity: high-NA EUV patterning materials, fine-pitch hybrid bonding, Mo word lines in 3D NAND, glass-core substrates, and PFAS-/fluorine-free ArF immersion resists.
- High-NA EUV
- Hybrid bonding
- 3D NAND
- Glass core
- PFAS / ArFi